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Home>>News>>Why use 50 degree+5%RH
Why use 50 degree+5%RH
recovered with all the three means, but baking under medium 90℃ or 40℃ must work with
relative humidity ≤5%RH, why? And why the traditional high temperature baking trends to
-40℃ (Ambient: Temperature 20℃, humidity 50%RH). Humidity can recover to 5%RH within
short time after door opening 30 seconds. Desiccant dry agent can recycle automatically,
no need to replace and mean power consumption is only 28W/h.
2. Insulated double metal sandwich construction can prevent losing of heat. This dry cabinet
can be used to bake with 40℃ as per IPC standard, dry tapes and reels with 50℃, or dry
PCBs with 60℃. The strong air flow inside can prevent repeated repacking and thermoplastic
packing. It saves cost and energy, and protects the component itself.
3. Storage time is unlimited, as it can be used for both baking and storage. And after components
with high MSLs are stored in Totech medium temperature dry cabinet for some time,
the components will be almost absolutely dry, with no need to pre-bake after they are taken
out from the cabinet.
4. It combines the functions of moisture proof, drying, baking, pausing and resetting floor
life. It operates smart with low energy consumption, and can be moved freely.
Previous:Application of Totech Super Dry and Auto Dry
Next: Totech Super Dry, 0%RH!
For the baking of SMT components, the latest IPC/JEDEC J-STD-033C recommends baking
under 90℃ and 40℃ besides the traditional 125℃ and the components’ floor life can berecovered with all the three means, but baking under medium 90℃ or 40℃ must work with
relative humidity ≤5%RH, why? And why the traditional high temperature baking trends to
be replaced?
1. Super Dry high speed dry units are installed. And inner dew point temperature can reach
-40℃ (Ambient: Temperature 20℃, humidity 50%RH). Humidity can recover to 5%RH within
short time after door opening 30 seconds. Desiccant dry agent can recycle automatically,
no need to replace and mean power consumption is only 28W/h.
2. Insulated double metal sandwich construction can prevent losing of heat. This dry cabinet
can be used to bake with 40℃ as per IPC standard, dry tapes and reels with 50℃, or dry
PCBs with 60℃. The strong air flow inside can prevent repeated repacking and thermoplastic
packing. It saves cost and energy, and protects the component itself.
3. Storage time is unlimited, as it can be used for both baking and storage. And after components
with high MSLs are stored in Totech medium temperature dry cabinet for some time,
the components will be almost absolutely dry, with no need to pre-bake after they are taken
out from the cabinet.
4. It combines the functions of moisture proof, drying, baking, pausing and resetting floor
life. It operates smart with low energy consumption, and can be moved freely.
Previous:Application of Totech Super Dry and Auto Dry
Next: Totech Super Dry, 0%RH!
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