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Home>>News>>Dry storage as per IPC standard
IPC/JEDEC Standard (J-STD-033C)
IPC/JEDEC has concluded the following joint standard for the handling SMD.
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Moisture Sensitivity Level 2-3 |
Below 10% RH storage is necessary. After the removal from a moisture barrier bag,the floor life of dry packages which is exposed under the environment not exceeding 30ºC and 60%RH can be reset, if they are placed in a dry box not greater than 10%RH for a minimum desiccating period of 5X the expose time. |
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Moisture Sensitivity Level 4-5a |
Below 5% RH storage is required. A minimum desiccating period of 10X the exposure time is necessary to dry the IC packages which are exposed not exceeding 30ºC and 60%RH after removing from a moisture barrier bag enough to reset their floor life. |
Reference: The floor life of IC packages after removing from the moisture barrier bag
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Level |
Floor Life* |
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1 |
unlimited at 30ºC / 85%RH |
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2 |
1 year |
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2a |
4 weeks |
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3 |
168 hrs |
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4 |
72 hrs |
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5 |
48 hrs |
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5a |
24 hrs |
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6 |
Baking is necessary |
*After removal from a moisture barrier bag, the allowable time of IC packages exposed to a factory ambient not exceeding 30ºCand 60%RH
SUPER DRY is the only choice for your ultra-low humidity storage
Once parts have been removed from their moisture barrier bags and placed safety in SUPER DRY defects at the end of the line will be reduced.
Prefect ultra-low RH storage in SUPER DRY
Easy Operation: SUPER DRY is an electric appliance, so just plug it in before using. Auto-recycling: Absorbed moisture is discharged as vapor without casing any problems of water leakage. Cost-saving: The maintenance fee of SUPER DRY is only 1/20 compared with N2gas storage box.
§ The Experts' opinion: Moisture-sensitiveComponents
§ The comparison between N2 gas storage and SUPER DRY storage
§ Moisture Sensitivity/ Desiccant: Packaging/Handling of PSMCs (from Intel)
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Products |
Humidity Setting and their Main features |
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1-50%RH (Drying Unit x 2) |
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Recommended whenever doors will be opened once an hour or once 2 hours. |
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2-50%RH (Drying Unit x 1) |
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Suitable for long term storage of MSD with infrequent door opening. |
The mechanism of micro-crack in Intergrated Circuits (ICs) packages
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Before reflow |
Reflow process |
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IC packages |
Normal Storage |
Moisture in the air is absorbed in the package.
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Delamination by heating at the first stage.
As process goes on, more pressure by heating will make the delamination become bigger.
The pressure from delamination makes cracks in the packages.
Cracks do not make any defects at first, however it gradually corrodes the IC chip. |
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SUPER DRY Storage |
SUPER DRY can dehumidify micro-moisture absorbed in the package.
JEDEC/IPC suggests the storage of device should be under 10%RH. |
SUPER DRY ensures high quality control for production with it ultra low humidity control.
HYPER series are recommended for the storage of IC packages during its production process. For faster dehumidification for taping devices, Easy Control series are recommended. |
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Strategy against Lead-free
Moisture trapped inside MSDs will cause defects during the reflow process. The introduction of a lead free process will only aggravate this reality. The data below shows that the vapor pressure becomes greater and greater with increasing reflow temperatures.
This vapor pressure can cause micro-cracking and delamination inside MSDs and in the end will result in failures, both at test and latent defects in the fields. With ultra-low humidity storage in SUPER DRY, the moisture inside IC packages can be dehumidified to nearly 0% preventing defects which can be caused by moisture absorption.
Specification is subject to change without prior notice for better quality.
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