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Baking reference  

Moisture is harmful to both electronics and micro-electronics. According to the ways of handling.packing, shipping and baking of moisture sensitive devices recommanded by IPC and experiments, an environment of 40+5%RH can improve the recovery of floor life greatly.

Thickness

 

Level

Humidity 1%RH

Baking

Humidity 2%RH Baking

Humidity 5%RH Baking

Exceeds floor life>72hrs    Baking

Thickness

1.4mm

 

25

1%RH

40

1%RH

25

2%RH

40

2%RH

40

5%RH

90

5%RH

 

2a

2 days

1 days

5 days

2 days

5 days

23 hrs

 

3

3 days

1 days

8 days

3 days

8 days

33 hrs

 

4

4 days

2 days

9 days

4 days

9 days

37 hrs

 

5

5 days

2 days

10 days

5 days

10 days

41 hrs

 

5a

6 days

2 days

10 days

6 days

10 days

54 hrs

 

Thickness

1.4mm

2.0mm

2a

10 days

3 days

22 days

10 days

22 days

3 days

 

3

11 days

3 days

23 days

11 days

23 days

4 days

 

4

14 days

4 days

28 days

14 days

28 days

5 days

 

5

16 days

5 days

35 days

16 days

35 days

6 days

 

5a

18 days

5 days

56 days

18 days

56 days

8 days

 

Thickness

2.0mm

4.5mm

2a

20 days

6 days

67 days

20 days

67 days

10 days

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